Singapore Institute of Technology

Desmond Y.R. Chong

Associate Professor (Engineering; Biomedical and clinical sciences; Education)


Dr Desmond Chong is currently an Associate Professor with the Engineering Cluster of Singapore Institute of Technology. He is also a Visiting Associate Professor with the Department of Orthopaedic Surgery of University of Malaya, and Virtual Visiting Professor with the Faculty of Medicine of Prince of Songkla University. He is a recipient of the Singapore Biodesign Faculty Fellowship in 2021. His research interests are in the areas of orthopaedic and musculoskeletal biomechanics, finite element analysis and experimentation, medical devices design, and human motion analyses. He is an active member of the American Society of Mechanical Engineers (ASME) and a senior member of The Institution of Engineers, Singapore (IES). He had served as the Chair of the ASME Singapore Section, District G Leader (Asia Pacific), and Chair for International Regions of the Member Development & Engagement Sector. He received the ASME Dedicated Service Award in 2022 for his voluntary service to the society.


  • Polka dot cementless talar component in enhancing total ankle replacement fixation: A parametric study using the finite element analysis approach
  • Finite element analysis of tibio‐femoral contact mechanics of a customised knee spacer
  • Morphological analysis of the temporomandibular joint in patients with anterior disc displacement
  • The effects of the size and strength of food on jaw motion and temporomandibular joints
  • A double button adjustable loop device is biomechanically equivalent to tension band wire in the fixation of transverse patellar fractures—A cadaveric study
  • Impact of mandibular prognathism on morphology and loadings in temporomandibular joints
  • Evaluation on influencing factors of board-level drop reliability for chip scale packages (fine-pitch ball grid array)
  • Biomechanical analysis of the placement of fixation lag screw in different intertrochanteric hip fracture angles
  • Work in progress: An engineering in medicine programme-opening engineering students mind through a living laboratory education
  • Engineers in hospital: An immersive and multidisciplinary pedagogical approach for better solutions
  • Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages
  • Drop reliability performance assessment for PCB assemblies of Chip Scale Packages (CSP)
  • Design and development of stacked die technology solutions for memory packages
  • Development of ball grid array packages with improved thermal performance
  • Bend fatigue reliability test and analysis for Pb-free solder joint
  • Drop impact reliability testing for lead-free and leaded soldered IC packages
  • Design and development of true-CSP
  • Stacked die technology solutions for wCSP memory packages
  • Development of a new improved high performance flip chip BGA package
  • Heat spreader impact on electrical performances of a 4-layer PBGA package
  • Drop test reliability assessment of leaded & lead-free solder joints for IC packages
  • Thermal management and characterization of flip chip BGA packages
  • Improving the reliability of quad flat no-lead packages through test & structural optimization
  • Mechanical characterization in failure strength of silicon dice
  • The relations between the stress in temporomandibular joints and the deviated distances for mandibular asymmetric patients
  • Finite element analysis of bone and implant stresses for customized 3D-printed orthopaedic implants in fracture fixation
  • The study of contact pressure of a customized knee spacer using finite element analysis
  • Effects of thickness and length of custom made insole on plantar pressure for diabetic foot with neuropathy: A finite element approach
  • Design and Multi-disciplinarity: Co-creation in Practice
  • Performance assessment on board-level drop reliability for chip scale packages (fine-pitch BGA)
  • Analysis of bone-prosthesis interface micromotion for cementless tibial prosthesis fixation and the influence of loading conditions
  • Finite element analysis of bone-prosthesis interface micromotion for cementless talar component fixation through critical loading conditions
  • The influence of bilateral sagittal split ramus osteotomy on the stress distributions in the temporomandibular joints of the patients with facial asymmetry under symmetric occlusions
  • The influence of tibial prosthesis design features on stresses related to aseptic loosening and stress shielding
  • Effects on loads in temporomandibular joints for patients with mandibular asymmetry before and after orthognathic surgeries under the unilateral molar clenching
  • Biomechanical analysis of proximal tibia bone grafting and the effect of the size of osteotomy using a validated finite element model
  • A biomechanical study of proximal tibia bone grafting through the lateral approach
  • Assessment of the impact of positive heels (Plantarflexion) and negative heels (dorsiflexion) shoes on human walking gait
  • The pressure in the temporomandibular joint in the patients with maxillofacial deformities
  • Biomechanical behaviour of temporomandibular joints during opening and closing of the mouth: A 3D finite element analysis
  • The influence of tibial component fixation techniques on resorption of supporting bone stock after total knee replacement
  • Changes in the Tibial Strain After Proximal Fibular Osteotomy: A Biomechanical Cadaveric Study
  • Exposed die-top encapsulation molding for an improved high-performance flip chip BGA package
  • Medial longitudinal arch biomechanics evaluation during gait in subjects with flexible flatfoot
  • Drop impact reliability testing for lead-free and lead-based soldered IC packages
  • Effects of custom-made insole materials on frictional stress and contact pressure in diabetic foot with neuropathy: Results from a finite element analysis
  • Computational biomechanical analysis of fixation performance and bone resorption of tibial prosthesis implantation
  • Cementless mis mini-keel prosthesis reduces interface micromotion versus standard stemmed tibial components
  • Biomechanical comparison of the effect of bilateral sagittal split ramus osteotomy with or without Le Fort I osteotomy on the temporomandibular joints of the patients with maxillofacial deformities under centric occlusion
  • Descriptions of the dynamic joint space of the temporomandibular joint
  • Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis
  • Thermal cycling analysis of flip-chip solder joint reliability
  • Thermal characterization of a thermally enhanced QFN package
  • Reliability analyses for new improved high performance flip chip BGA packages
  • Finite element parametric analysis on fine-pitch BGA (FBGA) packages
  • Mechanical failure strength characterization of silicon dice
  • Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

Desmond Y.R. Chong's public data