Desmond Y.R. Chong

Publications

• Polka dot cementless talar component in enhancing total ankle replacement fixation: A parametric study using the finite element analysis approach
• Finite element analysis of tibio‐femoral contact mechanics of a customised knee spacer
• Morphological analysis of the temporomandibular joint in patients with anterior disc displacement
• The effects of the size and strength of food on jaw motion and temporomandibular joints
• A double button adjustable loop device is biomechanically equivalent to tension band wire in the fixation of transverse patellar fractures—A cadaveric study
• Impact of mandibular prognathism on morphology and loadings in temporomandibular joints
• Evaluation on influencing factors of board-level drop reliability for chip scale packages (fine-pitch ball grid array)
• Biomechanical analysis of the placement of fixation lag screw in different intertrochanteric hip fracture angles
• Work in progress: An engineering in medicine programme-opening engineering students mind through a living laboratory education
• Engineers in hospital: An immersive and multidisciplinary pedagogical approach for better solutions
• Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages
• Drop reliability performance assessment for PCB assemblies of Chip Scale Packages (CSP)
• Design and development of stacked die technology solutions for memory packages
• Development of ball grid array packages with improved thermal performance
• Bend fatigue reliability test and analysis for Pb-free solder joint
• Drop impact reliability testing for lead-free and leaded soldered IC packages
• Design and development of true-CSP
• Stacked die technology solutions for wCSP memory packages
• Development of a new improved high performance flip chip BGA package
• Heat spreader impact on electrical performances of a 4-layer PBGA package
• Drop test reliability assessment of leaded & lead-free solder joints for IC packages
• Thermal management and characterization of flip chip BGA packages
• Improving the reliability of quad flat no-lead packages through test & structural optimization
• Mechanical characterization in failure strength of silicon dice
• The relations between the stress in temporomandibular joints and the deviated distances for mandibular asymmetric patients
• Finite element analysis of bone and implant stresses for customized 3D-printed orthopaedic implants in fracture fixation
• The study of contact pressure of a customized knee spacer using finite element analysis
• Effects of thickness and length of custom made insole on plantar pressure for diabetic foot with neuropathy: A finite element approach
• Design and Multi-disciplinarity: Co-creation in Practice
• Performance assessment on board-level drop reliability for chip scale packages (fine-pitch BGA)
• Analysis of bone-prosthesis interface micromotion for cementless tibial prosthesis fixation and the influence of loading conditions
• Finite element analysis of bone-prosthesis interface micromotion for cementless talar component fixation through critical loading conditions
• The influence of bilateral sagittal split ramus osteotomy on the stress distributions in the temporomandibular joints of the patients with facial asymmetry under symmetric occlusions
• The influence of tibial prosthesis design features on stresses related to aseptic loosening and stress shielding
• Effects on loads in temporomandibular joints for patients with mandibular asymmetry before and after orthognathic surgeries under the unilateral molar clenching
• Biomechanical analysis of proximal tibia bone grafting and the effect of the size of osteotomy using a validated finite element model
• A biomechanical study of proximal tibia bone grafting through the lateral approach
• Assessment of the impact of positive heels (Plantarflexion) and negative heels (dorsiflexion) shoes on human walking gait
• The pressure in the temporomandibular joint in the patients with maxillofacial deformities
• Biomechanical behaviour of temporomandibular joints during opening and closing of the mouth: A 3D finite element analysis
• The influence of tibial component fixation techniques on resorption of supporting bone stock after total knee replacement
• Changes in the Tibial Strain After Proximal Fibular Osteotomy: A Biomechanical Cadaveric Study
• Exposed die-top encapsulation molding for an improved high-performance flip chip BGA package
• Medial longitudinal arch biomechanics evaluation during gait in subjects with flexible flatfoot
• Drop impact reliability testing for lead-free and lead-based soldered IC packages
• Effects of custom-made insole materials on frictional stress and contact pressure in diabetic foot with neuropathy: Results from a finite element analysis
• Computational biomechanical analysis of fixation performance and bone resorption of tibial prosthesis implantation
• Cementless mis mini-keel prosthesis reduces interface micromotion versus standard stemmed tibial components
• Biomechanical comparison of the effect of bilateral sagittal split ramus osteotomy with or without Le Fort I osteotomy on the temporomandibular joints of the patients with maxillofacial deformities under centric occlusion
• Descriptions of the dynamic joint space of the temporomandibular joint
• Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis
• Thermal cycling analysis of flip-chip solder joint reliability
• Thermal characterization of a thermally enhanced QFN package
• Reliability analyses for new improved high performance flip chip BGA packages
• Finite element parametric analysis on fine-pitch BGA (FBGA) packages
• Mechanical failure strength characterization of silicon dice
• Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models